Tower Semiconductor and NewPhotonics have begun high-volume shipments of photonic integrated circuit optical engines, delivering 800G to 1.6T data transmission capacity for artificial intelligence infrastructure. The companies are commercializing a manufacturing process for these chips using Tower’s PH18DA platform, which enables monolithic integration of lasers, modulators, and detectors onto a single chip. “The next phase of AI infrastructure demands optical connectivity that scales in both production and performance,” said Doron Tal, SVP and GM of NewPhotonics, adding that the partnership is translating laser-integrated photonics into a practical, high-volume choice for customers.
Laser-Integrated PICs Enable 800G to 1.6T AI Interconnect Shipments
High-volume shipments of NewPhotonics’ NPG102 PIC products now support data rates from 800G to 1.6T, directly addressing the escalating bandwidth demands of artificial intelligence infrastructure. These chips feature 200G-per-lane designs and integrate lasers directly onto a monolithic photonic integrated circuit, a key advancement in optical signal processing. This unified architecture delivers improved power efficiency, bandwidth density, and manufacturing consistency for original equipment manufacturers and data center operators.
The availability of these PICs represents a shift from development to practical deployment, offering a scalable solution for AI interconnects. Tower Semiconductor’s PH18DA silicon photonics platform is central to this production ramp, enabling the heterogeneous integration of indium phosphide components alongside silicon. This allows for monolithic integration of lasers, semiconductor optical amplifiers, modulators, and photodetectors on a single chip, reducing complexity and variability in the manufacturing process.
According to Dr. Ed Preisler, Vice President and General Manager of Tower Semiconductor’s RF Business Unit, “We are excited to see our vision of integrating lasers with high-performance photonic integrated circuits come to fruition through scale-ready solutions optimized for FRO/LRO and NPO architectures.” Tower’s expertise in high-value analog semiconductor solutions, combined with NewPhotonics’ optical chip design, has resulted in a commercially viable pathway for laser-integrated photonics. The collaboration between the two companies extends beyond current shipments, with plans for 6.4T Near-Packaged Optics (NPO) solutions slated for volume production in the first half of 2027.
These future chipsets, designated NPC505 and compliant with the CPX-MSA standard, indicate a clear roadmap for significantly higher bandwidths. NewPhotonics is positioned to capitalize on this trajectory, having been the first to bring heterogenous laser-integrated optical engines on the PH18DA platform into high-volume production.
Tower Semiconductor, founded in 1993 and headquartered in Migdal Haemek, Israel, has increasingly focused on silicon photonics as a core competency. The company’s high-volume silicon photonics platform not only supports NewPhotonics but also is the foundation for a high-volume partnership with Xanadu, focused on manufacturing photonic quantum chips for fault-tolerant quantum computing. This diversification into quantum hardware demonstrates Tower’s commitment to advanced technologies beyond traditional optical communications. A recent partnership with OpenLight, announced on August 11, 2026, integrates design tools into Tower’s indium phosphide platform, accelerating photonic chip design processes.
See today’s quantum computing news on Quantum Zeitgeist for the latest breakthroughs in qubits, hardware, algorithms, and industry deals.




