The US Department of Commerce has awarded $285 million to establish the Semiconductor Manufacturing and Advanced Research with Twins (SMART) USA Institute, a national institute focused on “digital twins” for semiconductor manufacturing and advanced packaging. Purdue University is a lead academic institution in this consortium, which spans over 30 states and comprises more than 150 partners from industry, academia, national labs, and supply chain design and manufacturing.
The SMART USA Institute will focus on developing and using digital twins to advance semiconductor manufacturing, packaging, and assembly and test processes. Digital twins are virtual models that mimic physical counterparts, providing continuous feedback to adapt and optimize manufacturing processes. This technology can accelerate innovation in US chip development and manufacturing through cost reduction, product optimization, and real-time process adjustments.
Key individuals involved include Purdue President Mung Chiang, Todd Younkin, president and CEO of Semiconductor Research Corporation (SRC), and Dr. Laurie Locasio, undersecretary of the US Department of Commerce and director of the National Institute of Standards and Technology (NIST). Companies involved include SRC, SK hynix, and over 25 semiconductor companies that are members of the SRC.
Digital Twins Revolutionize Semiconductor Manufacturing with $285M SMART USA Institute
The U.S. Department of Commerce has awarded a $285 million grant to establish the Semiconductor Manufacturing and Advanced Research with Twins (SMART) USA Institute, a consortium led by Semiconductor Research Corporation (SRC) with Purdue University as the lead academic institution. This national institute will focus on developing and utilizing digital twins for semiconductor manufacturing, advanced packaging, and assembly and test processes.
Digital twins are virtual models that mimic physical counterparts’ structure, context, and behavior, providing continuous feedback in a closed loop to adapt and optimize manufacturing processes. They can exist in the cloud, enabling design and development across the country, which creates new opportunities for participation, speeds innovation, and reduces research and development costs. The SMART USA Institute will harness the power of digital twins to accelerate the design and innovation of new U.S. chip development and manufacturing concepts through cost reduction, product optimization, and real-time process adjustments.
Collaboration and Excellence in Semiconductor Ecosystem
The SMART USA Manufacturing Institute is built on a foundation of collaboration among technology companies, academia, government agencies, and engineers and scientists. SRC, a nonprofit American technology research consortium, serves as a platform for this collaboration, bringing together over 25 semiconductor companies that partner with universities and government agencies. The institute’s strategy is centered around teaming, which enables the collective strengths and expertise of partners to drive semiconductor innovation.
Purdue University, a national academic leader in microelectronics and semiconductors, will play a leadership role in developing digital twins and training the workforce. The university’s strengths in computational modeling and fabrication capabilities at the Birck Nanotechnology Center were critical elements that contributed to the successful proposal. Several Purdue faculty members played important roles in the proposal effort.
Advancing Digital Twin-Enabled Curricula and Workforce Development
The SMART USA Institute will focus on advancing digital twin-enabled curricula and creating hands-on opportunities for training the next generation of the domestic semiconductor workforce. This will involve utilizing artificial intelligence technology to help accelerate design and innovation of new U.S. chip development and manufacturing concepts.
Ganesh Subbarayan, director of the Institute for Advanced System Integration and Packaging (ASIP) and Purdue’s James G. Dwyer Professor of Mechanical Engineering, served as the founding executive committee member of this new institute. He emphasized that plans for the institute date back to an initial team-forming discussion followed by a workshop at the SRC in July 2021.
A Comprehensive Initiative in Computing and Semiconductors
The SMART USA Institute is part of Purdue Computes, a comprehensive initiative across computing departments, physical AI, semiconductors, and quantum science and engineering to enable unparalleled excellence at scale. This initiative demonstrates Purdue’s commitment to advancing the field of microelectronics and semiconductors, from world-leading research and industry partnerships to transformational investments in infrastructure and pioneering education and workforce development programs.
The CHIPS Manufacturing USA network, operated by the interagency Advanced Manufacturing National Program Office headquartered in the National Institute of Standards and Technology (NIST) in the Department of Commerce, will oversee the SMART USA Institute. This national program office is dedicated to fostering collaboration and excellence across the semiconductor ecosystem.
External Link: Click Here For More
