Element Six and Orbray have achieved a reproducible process for creating 3-inch wafer-scale single crystal diamond, a substantial advance in both size and manufacturing feasibility compared to conventional single crystal diamond materials. The companies are simultaneously preparing 2-inch wafer diamonds for volume production at Element Six’s chemical vapor deposition facility in Gresham, Oregon, specifically optimized for thermal bonding applications. Development of even larger 4-inch substrates is already underway, indicating continued scaling of this advanced material. “Our partnership with Orbray was built on shared strengths in innovation, quality and technical expertise,” said Siobhán Duffy, CEO of Element Six, “The progress we are making together shows how those core competencies translate into tangible delivery as we move closer to wafer-scale single crystal diamond at the quality and volumes our industrial customers need.”
Element Six and Orbray Advance 3-Inch Wafer-Scale Single Crystal Diamond
This milestone signifies a shift from research and development toward scalable manufacturing processes, addressing a critical need for advanced materials in emerging technologies. Simultaneously, the companies are finalizing 2-inch wafers specifically designed for epitaxial applications, broadening the potential for diamond-based devices. Production of 2-inch wafers optimized for thermal bonding is being prepared for volume output at Element Six’s Gresham, Oregon facility, leveraging its chemical vapor deposition capabilities. The collaborative effort between Element Six and Orbray has focused on simultaneously increasing wafer dimensions and improving manufacturing maturity, targeting applications in 6G wireless, power electronics, sensing, and quantum technologies. Ms. Riyako Namiki, President and CEO at Orbray, added: “The milestones achieved so far represent meaningful steps in the journey we started, together with Element Six, to expand commercial use of single crystal diamond, advancing material capability alongside the manufacturing volumes required to support the most demanding applications.” This progression signals a move toward industrial-scale production to meet growing demand.
The progress we are making together shows how those core competencies translate into tangible delivery, as we move closer to pioneering wafer-scale single crystal diamond at the quality and volumes our industrial customers need.
Siobhán Duffy, CEO of Element Six
Epitaxial and Thermal Bonding Applications of 2-Inch Diamond Wafers
Beyond achieving 3-inch wafer-scale single crystal diamond with a reproducible process, Element Six is now preparing 2-inch wafers specifically for thermal bonding applications at its Gresham, Oregon facility, which houses a chemical vapour deposition (CVD) capability crucial for manufacturing. These wafers are being readied for volume production, indicating a focused effort to supply materials tailored to specific industrial needs, rather than simply increasing overall size. Simultaneously, the company is finalizing 2-inch wafers optimized for epitaxial applications, broadening the range of potential uses for these advanced materials. This dual-track approach, preparing wafers for both thermal bonding and epitaxial growth, highlights a strategic move toward serving diverse sectors including 6G wireless, power electronics, and sensing technologies.
The companies have successfully established a reproducible process for 3-inch WSC diamond, representing a significant step change in size, uniformity and manufacturability compared to conventional single crystal (SC) diamond materials.
Source: https://www.e6.com/en/
