As superconducting quantum processors approach the 1,000-qubit threshold, a milestone IBM Quantum anticipates reaching by 2029, a critical bottleneck in scaling is coming into focus: reliably testing and qualifying the individual chiplets that comprise these complex systems. At the QBN Workshop in Dresden, Dr. Thorsten Last of OrangeQS will present how the company is adapting its MAX product line for non-destructive, automated chiplet testing prior to their integration into modular quantum processors. OrangeQS argues this data is also key to quantum chip production, identifying critical process steps and improving performance prediction.
Chiplet Qualification and MAX Testing for Modular Processors
OrangeQS is adapting its MAX product line to perform non-destructive, automated testing of quantum chiplets as the industry moves towards building larger, modular processors. This testing occurs prior to their integration, addressing a key bottleneck in scaling superconducting quantum systems. The company’s approach focuses on ensuring each chiplet meets performance criteria before assembly, streamlining the manufacturing process and reducing potential failures in complex, multi-chip architectures.
Data generated by the MAX product line is intended to facilitate closed-loop optimization within quantum chip production facilities. According to OrangeQS, this data identifies critical process steps and pinpoints which parameters most accurately predict final chip performance.
This move towards data-driven manufacturing aims to improve yield and consistency, essential for building reliable and scalable quantum computers. The company states that both chiplet qualification and data analysis are critical for the next phase of scaling circuit-based quantum processors. IPMS’s 300 mm CMOS quantum foundry provides vital infrastructure for this evolving landscape. The institute’s expertise in superconducting materials, interposers, and cryogenic characterisation supports European quantum pilot lines and projects, including QSolid, a collaborative effort with Forschungszentrum Jülich and GlobalFoundries.
Benjamin Lilienthal-Uhlig, Head of Next Generation Computing IPMS, oversees the development of these advanced fabrication processes. The institute supports quantum hardware as a component and process supplier.
Data-Driven Optimization Enables Quantum Chip Production Insights
The upcoming QBN Workshop at Fraunhofer IPMS will feature a detailed look at how data generated during chiplet testing can drive improvements in quantum processor manufacturing, according to OrangeQS. Dr. Thorsten Last will present how the company’s MAX product line facilitates closed-loop optimization, moving beyond simple quality control to actively refine production parameters based on performance data. OrangeQS views its MAX product line as a key enabler for industry-grade quantum chip production, offering a pathway to what they term a “lights-out” foundry.
The company’s white paper proposes that rigorous, data-rich testing forms the foundation for automated manufacturing, reducing reliance on manual intervention and increasing throughput. The company aims to transform testing from a verification step into a core component of the production cycle itself.
Fraunhofer IPMS’s role as host of the QBN Workshop emphasises its position as a central hub for quantum chip scaling efforts. The workshop, scheduled for October 7-8, 2026, will bring together experts to discuss manufacturing, foundry services and production strategies, with a focus on transitioning from prototypes to scalable quantum systems. The event’s focus on practical implementation reflects a growing emphasis on translating research breakthroughs into commercially viable quantum technologies.
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