Cadence and Intel Foundry have launched a multi-year collaboration targeting Intel’s 14A process technology, an effort to bolster Intel’s position in advanced chip manufacturing. The expanded cooperation will center on Design Technology Co-Optimization, leveraging Cadence’s AI-driven electronic design automation and Design IP solutions alongside Intel’s process innovation to optimize performance, power, and area for high-performance computing and mobile designs. “Advancing our relationship with Intel into a deeper partnership is a major milestone for both companies,” said Anirudh Devgan, president and chief executive officer, Cadence. This commitment extends beyond a single project, aiming to deliver production-ready design kits and accelerate time-to-market for customers building future products.
Cadence and Intel Foundry Expand DTCO for Intel 14A Process
The pursuit of more efficient chip design is intensifying as Cadence and Intel Foundry deepen their collaboration to optimize the Intel 14A process technology. This is a focused effort on a manufacturing node as Intel strives to bolster its position in the foundry services market. The agreement is a multi-year commitment, indicating a substantial investment of resources from both companies and a long-term vision for co-innovation; the collaboration will focus on delivering production-ready Process Development Kits (PDKs) optimized for the Intel 14A process, streamlining the design process for mutual customers. Intel Foundry’s executive vice president and general manager, Naga Chandrasekaran, emphasized the strategic importance of this collaboration, stating that by combining Intel’s process and packaging with Cadence’s AI-driven design tools, they are enabling deeper co-optimization, strengthening their ability to deliver on customers’ needs, and showcasing the ability of both companies to drive innovation at scale. The companies intend to accelerate time-to-market and reduce design risk through the integration of AI-powered design flows and core products, ultimately benefiting the broader semiconductor industry.
Agentic AI Flows Accelerate Design and Time-to-Market
The current push to accelerate chip design increasingly relies on artificial intelligence, moving beyond traditional electronic design automation tools to what industry leaders are calling “agentic AI” flows. Central to this partnership is Design Technology Co-Optimization, a process aimed at simultaneously developing the manufacturing process and the design tools used to create chips on that process. This co-optimization is intended to deliver improvements in performance, power consumption, and chip area, all critical metrics in modern chip design. The integration of Cadence’s AI flows is expected to accelerate time-to-market and reduce the risks associated with complex chip designs.
Our expanded collaboration with Cadence reflects Intel Foundry’s continued focus on delivering on its technology roadmap and ecosystem on behalf of our customers.
Naga Chandrasekaran, executive vice president and general manager of Intel Foundry
