Raytron’s New Detector Cuts Infrared Core Size By 74%

Raytron has unveiled the OHLE6081, a second-generation uncooled infrared detector and the first built using wafer-level packaging technology. The detector achieves a substantial reduction in size, measuring just 11.2×11.2 mm, a 74% decrease compared to previously available 640×512 ceramic-packaged thermal detectors. This compact design is paired with a high-resolution 640×512 image and an 8μm pixel pitch, enabling detailed infrared imaging in applications like commercial drones and handheld devices. According to Raytron, the OHLE6081’s wafer-level packaging enables assembly in standard environments without dependency on cleanroom facilities, potentially lowering manufacturing costs and accelerating production for a wider range of infrared applications.

OHLE6081: SWLP-Based 8μm Infrared Detector

The introduction of the OHLE6081 detector represents a substantial shift in infrared imaging technology. Raytron has successfully implemented wafer-level packaging in a second-generation uncooled infrared detector, a first for the industry, and it promises to reduce manufacturing expenses. Traditional infrared detector production relies heavily on costly Class 100 cleanrooms and intricate integration procedures, limiting scalability. Wafer-level packaging circumvents these requirements by enabling assembly in standard environments and compatibility with surface-mount technology processes. This innovation is not merely about cost reduction; the OHLE6081 achieves a 74 percent decrease in core size compared to previous 640×512 ceramic-packaged thermal detectors, allowing for integration into increasingly compact devices. This miniaturization is coupled with high performance, as the detector utilizes an 8μm pixel pitch alongside a 640×512 resolution, delivering enhanced detail recognition without increasing overall size or power consumption. Raytron highlights three key trends driving this development: the demand for smaller terminals in applications like commercial drones, the need for cost-effective manufacturing, and rising expectations for image quality and temperature measurement range.

The OHLE6081 addresses these demands with a detector capable of covering a temperature range of -40°C to 800°C while maintaining an ultra-compact size of 11.2 x 11.2 mm, a weight of less than 1 gram, and power consumption under 120 mW. The detector’s VOx sensor achieves a noise equivalent temperature difference of less than 50 mK, ensuring high-quality, low-noise imaging for precise target detection. Raytron states that “Combining an 8μm pixel pitch, 640×512 resolution and an ultra-compact 11.2×11.2 mm design, the infrared detector is designed for seamless integration and applications such as commercial drones, industrial thermography, outdoor night vision, and ADAS.” The company anticipates this technology will drive a new wave of scalable infrared cores for a wider range of applications.

VOx Sensor Achieves NETD < 50mK & Wide Temperature Range

The demand for infrared imaging continues to expand beyond traditional military and scientific applications, now driving innovation in consumer drones, automotive safety systems, and portable diagnostic tools. Achieving both high performance and affordability has remained a key challenge for detector manufacturers. This level of sensitivity, combined with a 640×512 resolution, allows for the detection of subtle temperature variations and detailed thermal imaging, crucial for applications like early fault detection in industrial settings and enhanced night vision capabilities. A significant engineering achievement within the OHLE6081 is the integration of an 8μm pixel pitch alongside the high resolution, a combination that previously demanded larger and more expensive detector formats. Beyond image quality, Raytron has focused on manufacturability; the OHLE6081 is the first second-generation uncooled infrared detector utilizing wafer-level packaging. This focus on streamlined production is reflected in the detector’s physical dimensions; at just 11.2×11.2 mm, the core size is reduced by approximately 74% compared to conventional ceramic-packaged thermal detectors.