Xanadu and DISCO Collaborate on Photonic Quantum Chip Packaging

A collaborative effort between Xanadu, a Canadian quantum computing company founded in 2016, and DISCO Corporation, a Japan-based semiconductor manufacturing equipment company established in 1937, is focused on refining wafer processing techniques critical for photonic quantum computing applications. This partnership concentrates on optimising wafer dicing, specialised preparation for heterogeneous integration, and polishing processes to achieve ultra-smooth surfaces, leveraging DISCO’s precision dicing and thinning equipment – notably their Kiru (cutting), Kezuru (grinding), and Migaku (polishing) technologies – and turn-key services, including laser processes such as Stealth Dicing. High-quality wafer dicing, facilitated by DISCO’s machinery which holds the largest world market share in this area, is essential for the singulation of photonic chips and contributes to the reduction of optical losses, while the elimination of manual polishing streamlines manufacturing and enables scaling to high-volume photonic packaging, directly supporting Xanadu’s goal of a utility-scale photonic quantum computer and their development of the PennyLane open-source software library. Christian Weedbrook (founder and CEO, Xanadu) and Steve Latina (technical solution lead and account manager, DISCO USA) highlight the shared paradigm of ‘every photon counts’ as a driving force behind achieving unprecedented precision and cleanliness in manufacturing processes, crucial for minimising optical loss throughout photonic components and advancing the field beyond current limitations.

Photonic Chip Advancement

Xanadu, a Canadian quantum computing company founded in 2016, and DISCO Corporation, a Japan-based semiconductor manufacturing equipment company established in 1937, have initiated a collaborative effort focused on refining techniques for photonic wafer processing. This partnership centres on advancements in wafer dicing, specialised wafer preparation for heterogeneous integration, and optimisation of polishing processes – all critical for the development of high-performance photonic integrated circuits and scalable photonic chip packaging. The collaboration aims to address the stringent requirements of both quantum computing applications and broader advanced photonic technologies, with a particular emphasis on minimising optical losses. The core of this advancement lies in DISCO’s precision dicing and thinning equipment, which holds the most significant world market share in this sector, and Xanadu’s expertise in photonic technology, but extends across the broader industry, impacting equipment, foundry processes, and materials science. This highlights the potential for cross-pollination of innovation, where advancements made for quantum applications can benefit other fields reliant on high-precision photonic components. The shared principle of ‘every photon counts’, as articulated by Latina, underscores the critical need for minimising optical losses throughout the entire photonic circuit. This challenge demands unprecedented levels of precision in manufacturing.

Furthermore, the collaboration’s emphasis on streamlining manufacturing processes, particularly through the elimination of manual polishing steps, is significant for scalability and cost reduction. Conventional wafer dicing often necessitates post-dicing polishing to remove subsurface damage and achieve the required surface finish. DISCO’s technologies, including Stealth Dicing – a laser-based technique – minimise this damage, reducing or eliminating the need for manual intervention and improving throughput. This not only lowers manufacturing costs but also enhances process control and repeatability, crucial for mass production of photonic quantum processors. Christian Weedbrook, CEO of Xanadu, affirms that DISCO’s contributions are pivotal to achieving their goal of a utility-scale photonic quantum computer, demonstrating the tangible benefits of this industrial partnership.