Lightmatter, based in Mountain View, CA, has unveiled the Passage L200, the first 3D co-packaged optics (CPO) solution designed for XPUs and switches to address bandwidth bottlenecks in AI applications. Available in 32 Tbps and 64 Tbps versions, this product offers significant performance improvements over existing solutions. Collaborating with Alphawave Semi, Lightmatter leverages advanced manufacturing partners like Global Foundries and ASE to deliver a scalable solution for hyperscalers and chip manufacturers. The L200 will be available in 2026 and is set to showcase at the Optical Fiber Conference in San Francisco.
Lightmatter Announces Passage L200
The Passage L200 addresses critical bandwidth challenges in AI systems by integrating 3D co-packaged optics (CPO) with XPUs and switches. This solution enables higher data transfer rates, crucial for efficient AI processing, through a modular design that allows SerDes placement anywhere on the die, breaking free from traditional edge-based constraints.
The collaboration with Alphawave Semi enhances connectivity by leveraging UCIe die-to-die interfaces and advanced chiplet technology. This integration involves 3D stacking of Electrical Integrated Circuits (EICs) onto Photonic Integrated Circuits (PICs), enabling efficient space utilization and improved signal integrity. The solution equates to having 40 pluggable optical transceivers per L200, significantly advancing connectivity capabilities.
Key features include advanced CMOS EICs, a 32Gbps UCIe interface, optimized SerDes, and WDM capabilities with 16 wavelengths per waveguide. These elements collectively support faster processing and reduced latency, essential for handling larger AI models and complex workloads.
The availability of L200 models starting in 2026 is poised to accelerate the development of next-generation XPUs and switches, providing scalable solutions that adapt to evolving AI infrastructure needs.
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