In a partnership, Lightmatter, a leader in photonic supercomputing, has teamed up with Amkor Technology, a leading semiconductor packaging and test services provider, to create the world’s largest 3D-packaged chip complex. This collaboration brings together Lightmatter’s innovative Passage platform, which uses 3D-stacked photonic engines, and Amkor’s advanced multi-die packaging expertise to meet the unprecedented interconnect scaling and power demands of today’s Artificial Intelligence (AI) workloads.
The partnership aims to overcome the limitations of traditional chip design by integrating more silicon in a single package. Lightmatter’s Passage platform enables optical I/O anywhere across the chip area, providing significantly higher connection density and bandwidth both within and outside the package. Ritesh Jain, SVP of Engineering and Operations at Lightmatter, hailed the partnership as a “pivotal step” in building a world-class ecosystem for AI and high-performance computing offerings. Kevin Engel, EVP, Business Units at Amkor, expressed excitement about collaborating with Lightmatter to bring this groundbreaking silicon photonics technology to mainstream market availability.
Revolutionizing AI Infrastructure with 3D Photonics Packaging
The partnership between Lightmatter and Amkor Technology marks a significant milestone in the development of artificial intelligence (AI) infrastructure. Combining their photonics expertise and advanced semiconductor packaging, they aim to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform. This collaboration addresses the pressing need for increased interconnect scaling and power efficiency in AI workloads.
The limitations of traditional silicon interposers are well-documented. As AI processors grow larger, their power consumption doubles every two years, making it essential to find new solutions that can keep up with the demands of AI computing. Lightmatter’s Passage platform offers a groundbreaking approach by using 3D integration of customer dies directly onto a silicon photonic interconnect. This enables optical I/O anywhere across the chip area, providing significantly higher connection density and bandwidth both within and outside the package.
The partnership between Lightmatter and Amkor Technology is crucial in delivering unmatched advantages of this combined solution to customers. By leveraging Amkor’s advanced multi-die packaging expertise, they can create a 3D package that integrates thousands to millions of processors at the speed of light. This technological achievement paves the way for the next major computing advances, including Artificial General Intelligence (AGI).
Overcoming Shoreline Constraints with 3D Stacked Photonic Engines
The Passage platform is designed to overcome the shoreline constraints that limit traditional silicon interposers. By using 3D integration of customer dies directly onto a silicon photonic interconnect, Lightmatter’s technology enables optical I/O anywhere across the chip area. This approach provides significantly higher connection density and bandwidth both within and outside the package.
The Passage platform also natively integrates Optical Circuit Switching (OCS) within the interconnect, offering enhanced resiliency and flexibility in interconnect topology. This is particularly important for AI workloads that require high-bandwidth and low-latency communication between processors and memory.
Unprecedented Silicon Density and Bandwidth
The combined expertise of Lightmatter and Amkor Technology has led to a breakthrough that unlocks unprecedented silicon density and bandwidth within a single package. By integrating thousands to millions of processors at the speed of light, their technology enables unparalleled efficiency and scalability for the most advanced AI and high-performance computing workloads.
This technological achievement is critical in pushing the boundaries of AI infrastructure. As AI processors continue to grow larger and more complex, it is essential to find new solutions that can keep up with their power consumption and bandwidth demands. The partnership between Lightmatter and Amkor Technology marks a significant step forward in this direction.
Enabling Next-Generation AI Computing
The collaboration between Lightmatter and Amkor Technology has far-reaching implications for the development of next-generation AI computing. By enabling unparalleled efficiency and scalability, their technology paves the way for the widespread adoption of AI in various industries, including healthcare, finance, and transportation.
As AI continues to transform various aspects of our lives, it is essential to develop infrastructure that can keep up with its demands. The partnership between Lightmatter and Amkor Technology marks a significant step forward in this direction, enabling the next giant leaps in human progress.
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