IBM and the University of Dayton have established a joint research and development collaboration focused on next-generation semiconductor technologies and materials. To support this initiative, IBM will contribute state-of-the-art semiconductor equipment—valued at over $10 million—to the University of Dayton for the creation of a new nanofabrication facility planned for completion in early 2027. This facility will serve as a hub for advanced semiconductor research and workforce development, advancing critical technologies for the age of AI, including AI hardware, advanced packaging, and photonics, while providing hands-on learning opportunities for students and researchers.
Joint Research and Development of Semiconductor Technologies
IBM and the University of Dayton have entered into a joint research and development agreement focused on next-generation semiconductor technologies and materials. This collaboration aims to advance technologies critical for the age of AI, specifically in areas like AI hardware, advanced packaging, and photonics. To facilitate this research, IBM will contribute state-of-the-art semiconductor equipment—valued at over $10 million—to establish a new nanofabrication facility on the University of Dayton’s campus.
The new semiconductor nanofabrication facility is planned for completion in early 2027 and will serve as a hub for both advanced research and workforce development. University of Dayton students and researchers will gain hands-on experience through “lab-to-fab” learning opportunities. The initiatives will be jointly guided by a dedicated faculty member from the University of Dayton and a Technical Leader from IBM, fostering collaboration between academic and industry experts.
This agreement builds upon an existing relationship between IBM and the University of Dayton, including participation in the University of Dayton’s Digital Transformation Center and the AI Alliance (launched in 2023). Anchored in Dayton, Ohio, the collaboration aims to establish a new research and development ecosystem, potentially driving regional and national impact and bolstering the U.S. semiconductor industry’s workforce.
New Nanofabrication Facility and Workforce Development
IBM and the University of Dayton are collaborating to establish a new semiconductor nanofabrication facility on the University of Dayton’s campus. This facility will support joint research and development of next-generation semiconductor technologies and materials, specifically focusing on advancements for AI hardware, advanced packaging, and photonics. Planned for completion in early 2027, the facility aims to be a hub for both research and workforce development, offering hands-on learning opportunities for students and researchers.
The collaboration includes a contribution of state-of-the-art semiconductor equipment from IBM, estimated at over $10 million. This equipment will be instrumental in providing lab-to-fab learning experiences and training the next generation of engineers. Dedicated faculty from the University of Dayton, alongside IBM Technical Leaders, will guide research initiatives, fostering collaboration between academic and industry experts.
This partnership builds on existing ties between IBM and the University of Dayton, including involvement in the Digital Transformation Center and the AI Alliance launched in 2023. The goal is to cultivate a skilled workforce essential for the U.S. semiconductor industry and establish a new research and development ecosystem anchored in Dayton, Ohio, potentially driving regional and national impact.
IBM and University of Dayton Collaboration History
IBM and the University of Dayton announced a collaboration in November 2025 to jointly research and develop next-generation semiconductor technologies and materials. This partnership aims to advance technologies critical for the age of AI, specifically focusing on AI hardware, advanced packaging, and photonics. Supporting this effort, IBM will contribute state-of-the-art semiconductor equipment to establish a new nanofabrication facility on the University of Dayton’s campus, furthering research and workforce development opportunities.
The new semiconductor nanofabrication facility is planned for completion in early 2027 and will function as a hub for advanced semiconductor research. IBM’s equipment contribution is valued at over $10 million, providing hands-on learning experiences for University of Dayton students and researchers. The initiative will be guided by both University of Dayton faculty and IBM Technical Leaders, creating a collaborative environment for innovation and skill-building in a crucial field.
This agreement builds upon a pre-existing relationship between IBM and the University of Dayton, including joint work within the University of Dayton’s Digital Transformation Center and as members of the AI Alliance launched in 2023. Anchored in Dayton, Ohio, the collaboration aims to establish a new research and development ecosystem with the potential to drive regional and national impact, particularly in semiconductor workforce development and the tech ecosystem.
This is an important moment for the University of Dayton. Deepening our relationship with IBM with this research collaboration will help position UD as a leader in semiconductor and emerging technology research and enable our faculty and students to conduct groundbreaking work.
Eric F. Spina, President, University of Dayton
