Ayar Labs Expands Team & Presence to Boost AI Infrastructure

Ayar Labs is expanding its operations with the appointment of Vivek Khanzod as VP of Engineering and the opening of a new office in Hsinchu, Taiwan, alongside a doubling in size of its San Jose headquarters. These moves support the company’s focus on co-packaged optics (CPO) for artificial intelligence workloads, following a $155 million Series D funding round from investors including AMD, Intel Capital, and NVIDIA. Scott Clark will oversee operations in Taiwan as part of this expansion, intended to bolster partnerships within the semiconductor ecosystem.

Leadership Expansion and Geographic Growth

Ayar Labs has expanded its leadership team with the appointment of Vivek Khanzod as Vice President of Engineering, bringing with him 30 years of experience, most recently from Marvell Technology, Inc., where he led validation for products shipping in the hundreds of millions annually. This appointment is intended to support the company’s progress towards high-volume manufacturing and commercial adoption of its technologies. The company anticipates this leadership will be instrumental as it scales operations and addresses the growing demand for advanced AI connectivity solutions.

To further support its growth, Ayar Labs has established a new office in Hsinchu, Taiwan, and doubled the size of its San Jose headquarters. The Taiwan location places the company within the global semiconductor ecosystem, providing access to talent and strengthening partnerships with key industry players. Scott Clark, Vice President of Manufacturing & Operations, will oversee the company’s operations in Taiwan while being based there.

This expansion coincides with the unveiling of Ayar Labs’ UCIe optical interconnect chiplet for co-packaged optics, designed to maximize AI infrastructure performance and efficiency. Ayar Labs recently secured $155 million in Series D funding from investors including AMD, Intel Capital, and NVIDIA to address the need for scalable, cost-effective AI infrastructure. The company is currently hiring for engineering and related roles in both the U.S. and Taiwan, with career opportunities listed on its website.

Advancing Co-Packaged Optics Technology

The expansion of Ayar Labs’ leadership team and global presence occurs alongside the introduction of its UCIe optical interconnect chiplet for co-packaged optics, a technology designed to eliminate data bottlenecks and improve AI infrastructure performance. This chiplet aims to maximize efficiency while reducing latency and power consumption.

Ayar Labs recently secured $155 million in Series D funding from investors including AMD, Intel Capital, and NVIDIA, specifically to address the need for scalable, cost-effective AI infrastructure investment. The company is actively recruiting for engineering and related positions in both the United States and Taiwan, with details available on the Ayar Labs careers page.

Resources are available detailing information on who benefits financially from AI advancements, methods for improving the scale-up performance of AI clusters with optical I/O, and details concerning the detachable optical connector ecosystem. Ayar Labs offers a range of products including its Optical I/O Solution, TeraPHY Optical I/O Chiplet, SuperNova Light Source, and Optical I/O Evaluation Kit, serving sectors such as Aerospace, Artificial Intelligence, Cloud & Data Center, HPC, and Telecommunications.

Market Position and Product Portfolio

Ayar Labs’ product portfolio includes the Optical I/O Solution, TeraPHY Optical I/O Chiplet, SuperNova Light Source, and Optical I/O Evaluation Kit. These products serve a diverse range of industries, encompassing Aerospace, Artificial Intelligence, Cloud & Data Center, High-Performance Computing (HPC), and Telecommunications.

The company’s recent $155 million Series D funding round, secured from investors including AMD, Intel Capital, and NVIDIA, is directed towards addressing the need for scalable, cost-effective AI infrastructure. Ayar Labs also offers resources detailing information on financial aspects of AI, improving AI cluster performance with optical I/O, and the detachable optical connector ecosystem.